Products

Trade Shows

27.02. - 01.03.2018, Nuremberg
Hall 1, Booth 1-670

 

Real-Time 3D Imaging with MLX75023

Contact:

Germany / General
André Huntrieser
✆: +49 (0) 2129 - 376-202
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Field Applications Engineer
Günter Fuchs
✆: +49 (0) 2129 376-200
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Tech Support
Raphael Balke
✆: +49 (0) 2129 376-200
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Austria / Switzerland
Karl Eder
✆: +43 (0) 7448 - 21643-11
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 The MLX75023 is a QVGA (320x240 pixel) resolution optical Time-of-Flight (ToF) camera sensor. Combined with a modulated light source, this sensor is capable of measuring distance and reflectivity at full resolution.
The high dynamic range DepthSense™ ToF pixels support up to 120 klux background light. The sensor is available in a chip scale glass ball grid array (BGA) package and offers many integration possibilities.
Melexis' Time-of-Flight sensors enable robust 3D imaging solutions with minimal post-processing cost and large scalability of resolution, range and field-of-view. Our MLX75023 engineering samples and reference application schematic are available on request.


file link icon MLX75023-Datasheet

file link icon EVK75123-Evaluation Board

Features Application examples
  • 320 x 240 DepthSense™ ToF pixels
  • Spectral response in range 800-900nm
  • 600 FPS raw image framerate
  • 1/3” Sensor format (4.8 x 3.6 mm2)
  • Suitable for LED or laser illumination
  • Small glass BGA package
  • High ambient light robustness
  • Sensor modulation frequency up to 40 MHz
  • Ambient temperature range: –40 to +105 °C
  • Automotive - Body, HVAC, Comfort & Lighting
  • Building, Security, Home & Office Automation
  • Automotive - Chassis & Safety
  • Non-Automotive Transportation
  • Industrial & Robotics