Trade Shows

 
26.02. - 28.02.2019, Nuremberg

 

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ACCURATE, SUNLIGHT AND TEMPERATURE ROBUST 3D RANGE DETECTION

The MLX75026 QVGA is the second member of the third generation of fully integrated optical time-of-flight (ToF) sensor ICs. It is compatible with the MLX75027 VGA resolution ToF sensor IC. Thanks to an elementary triple low voltage supply architecture, the sensor enables the design of very compact 3D cameras. Target applications include automotive driver monitoring (DMS), in-cabin monitoring (ICM), exterior cocooning as well as robotics, autonomous transport (AGVs), people and 3D object detection in industry, retail, logistics and smart cities. In automotive interior sensing use cases, while one VGA resolution sensor covers the full interior of a car, the MLX75026 QVGA ToF sensor IC offers a similar resolution for single-seat areas e.g. for driver monitoring, body position, occupancy classification, etc.

The sensor features a QVGA (320x240) pixel array and comes in a small package size and small ¼” optical format. Its full compatibility with the VGA ToF sensor highly facilitates the reuse of existing software, which eases migration paths between cost-effective QVGA and more high-end VGA solutions.

An EVK75026 evaluation kit is available to get started with the MLX75026 QVGA ToF sensor IC.

The MLX75026 is also available with an integrated 940nm band pass filter. The integrated infrared bandpass filter simplifies the module design and manufacturing, while also increasing the choice of suitable IR-friendly lenses.

Features and Benefits
  • Supports both 850 and 940 nm wavelength
  • Integrated 940nm narrow band pass filter in option
  • QVGA (320 x 240 pixels) resolution
  • High distance accuracy due to programmable modulating frequencies up to 100 MHz
  • Full resolution readout up to 180 fps (distance frames in 4 phase configuration)
  • 1/4” optical format
  • 0.8 ms phase readout time
  • Up to 8 raw phases per frame, per-phase statistics & diagnostics
  • 2 data lanes
  • Region of interest (ROI) selection, integrated support for binning (2x2, 4x4, 8x8), horizontal mirror & vertical flip image modes:
    • Continuous or triggered operation mode(s)
    • Configurable over I2C (up to 400 kHz)
    • CSI-2 serial data output, MIPI D-PHY, 1 clock lane
  • Built-in temperature sensor
  • Package: 9.2 x 7.8 x 1.0 mm encapsulated (80 pins)
  • Ambient operating temperature range -40 +105 °C (ambient temperature)
  • AEC-Q100 qualified (grade 2)
Application Examples
  • Hand position detect
  • Hand gestures
  • Intuitiv HMI pointing finger
  • Object detection parcel classification
  • Face and body recognition
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Martin WesselingLine Management SenseDiese E-Mail-Adresse ist vor Spambots geschützt! Zur Anzeige muss JavaScript eingeschaltet sein!
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